| PART |
Description |
Maker |
| DP5Z2MW16PY3-12M DP5Z2MW16PH3-12M DP5Z2MW16PI3-12C |
2M X 16 FLASH 5V PROM MODULE, 120 ns, CQCC48 HERMETIC SEALED, CERAMIC, LEADLESS, MODULE, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 120 ns, QFP48 HERMETIC SEALED, CERAMIC, GULLWING, MODULE, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 120 ns, QIP48 HERMETIC SEALED, CERAMIC, STRAIGHT, MODULE, SLCC-48
|
Twilight Technology, Inc.
Elektron Technology PLC
|
| DP5Z2MX16PAY3-70I DP5Z2MX16PAI3-70B DP5Z2MX16PAJ3- |
2M X 16 FLASH 5V PROM MODULE, 70 ns, CQCC48 HERMETIC SEALED, CERAMIC, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 70 ns, CQIP48 HERMETIC SEALED, STRAIGHT-LEAD, CERAMIC, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 70 ns, CQCC48 HERMETIC SEALED, J-LEAD, CERAMIC, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 70 ns, CQFP48 HERMETIC SEALED, GULLWING-LEAD, CERAMIC, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 70 ns, CPGA50 DENSE STACK, PGA-50
2M X 16 FLASH 5V PROM MODULE, 120 ns, CQIP48 HERMETIC SEALED, STRAIGHT-LEAD, CERAMIC, SLCC-48
|
Alliance Semiconductor, Corp.
Linear Integrated System, Inc
|
| MC-7896-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
| TH50VPN564 TH50VPN5640EBSB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS PSEUDO SRAM AND NAND E2PROM MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| DPZ256X16IH3-17C DPZ256X16II3-17C |
256K X 16 FLASH 12V PROM MODULE, 170 ns, QFP48 HERMETIC SEALED, CERAMIC, GULLWING, MODULE, SLCC-48
256K X 16 FLASH 12V PROM MODULE, 170 ns, QIP48 HERMETIC SEALED, CERAMIC, STRAIGHT, MODULE, SLCC-48
|
Twilight Technology, Inc.
|
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| DP5Z4MX16PI3-12C |
4M X 16 FLASH 5V PROM MODULE, 120 ns, CQIP48 HERMETIC SEALED, CERAMIC, STRAIGHT, MODULE, SLCC-48
|
Twilight Technology, Inc.
|
| MC-7833 MC-7833-AZ |
GaAs MULTI-CHIP MODULE
40 MHz - 870 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
|
NEC
|
| SKY77602 |
Multi-Band, Multi-Mode (3G) Power Amplifier Module w/ PA Distribution Switch
|
Skyworks Solutions Inc.
|
| AHP2812D AHP2805D AHP2815D AHP2812DW/CH AHP2812DX/ |
HIGH RELIABILITY HYBRID DC/DC CONVERTERS
2-OUTPUT 77.56 W DC-DC REG PWR SUPPLY MODULE HERMETIC SEALED PACKAGE-12
2-OUTPUT 64.64 W DC-DC REG PWR SUPPLY MODULE HERMETIC SEALED PACKAGE-12
|
International Rectifier
E-Switch, Inc.
|
|
